Nanosens has access to and uses various up-to-date modern equipment and techniques of micro and nanofabrication technology such as: E-beam and Laser Interference Lithography (LIL), FIB, IBE, High-resolution SEM and TEM, XPS, EDX, Micro- and Nano-Imprinting etc. to make and characterize fabricated nanodevices.

Nanosens has also developed several propriety, innovative processes that allow fabrication of various nanostructures and nanodevices at a greatly reduced cost. All the devices are processed in a class 10 – 100 clean-room environments.

Also, we are in a close contact with the MESA + Research Institute for nanotechnology, Dimes Technology Centre, NanolabNL, and Philips High Tech Campus, which are all the centers of multidisciplinary knowledge and technological expertise. The combination of know-how and facilities is an ideal environment for reaching innovative industrial solutions.


Nanosens offers MEMS/NEMS technology services and innovative products based on MEMS/NEMS technology.

Wafer sizes and Materials

  • Sizes: 4 to 6”
  • Materials: Silicon, Glass, Quartz, SOI, and some plastics

Thin film depositions

  • (LP)CVD: low stress silicon nitride (SixNy)
  • (LP)CVD: CMOS silicon nitride (Si3N4)
  • PECVD SiO2
  • Wet and dry oxidation SiO2
  • TEOS silicon oxide


  • Metalization of various metals and alloys; including Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, CuNi, NiFe, W, PdAg, PdCu, PdAu etc.


  • Contact mask lithography
  • Front to back alignment contact mask lithography
  • Laser interference
  • E-beam lithography


  • Wet etching (KOH etching of Si, Glass etching in BHF, and Metal etching in various solutions)
  • Reactive ion etching
  • Deep reactive ion etching
  • Ar ion beam etching
  • High resolution ( Ga+) focused-ion beam milling
Wafer bonding
  • Anodic bonding
  • Direct bonding
  • Fusion bonding
  • Intermediate bonding