Facilities and Services

Facilities

Nanosens has access to and uses various up-to-date modern equipment and techniques of micro and nanofabrication technology such as: E-beam and Laser Interference Lithography (LIL), FIB, IBE, High-resolution SEM and TEM, XPS, EDX, Micro- and Nano-Imprinting etc. to make and characterize fabricated nanodevices.

Nanosens has also developed several propriety, innovative processes that allow fabrication of various nanostructures and nanodevices at a greatly reduced cost. All the devices are processed in a class 10 – 100 clean-room environments.

Also, we are in a close contact with the MESA + Research Institute for nanotechnology (http://www.mesaplus.utwente.nl); DIMES

(http://www.dimes.tudelft.nl); Philips High Tech Campus and ASML (Veldhoven), which are all the centers of multidisciplinary knowledge and technological expertise. The combination of know-how and facilities is an ideal environment for reaching innovative industrial solutions.

Services

Nanosens offers MEMS/NEMS technology services and innovative products based on MEMS/NEMS technology.

Wafer sizes and Materials

* Sizes: 4 to 6”
* Materials: Silicon, Glass, Quartz, SOI, and some plastics

Thin film depositions

* (LP)CVD: low stress silicon nitride (SixNy)
* (LP)CVD: CMOS silicon nitride (Si3N4)
* PECVD SiO2
* Wet and dry oxidation SiO2
* TEOS silicon oxide

Metalizations

* Metalization of various metals and alloys; including Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, CuNi, NiFe, W, PdAg, PdCu, PdAu etc.

Lithography

* Contact mask lithography
* Front to back alignment contact mask lithography
* Laser interference
* E-beam lithography

Etching

* Wet etching (KOH etching of Si, Glass etching in BHF, and Metal etching in various solutions)
* Reactive ion etching
* Deep reactive ion etching
* Ar ion beam etching
* High resolution ( Ga+) focused-ion beam milling

Wafer bonding

* Anodic bonding
* Direct bonding
* Fusion bonding
* Intermediate bonding

Etching and Deposition

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